• 240-pin Fully Buffered ECC Dual-In-Line DDR2 SDRAM Module
• Module Organization: two ranks, 256Mx72
• JEDEC standard DDR2 SDRAMs with 1.8V ± 0.1V Power Supply
• Re-drive and re-sync of all address, command, clock and data signals using AMB (Advanced Memory Buffer)
• High speed Differential Point-to-Point Link Interface at 1.5V.
• Host Interface and AMB component industry standard compliant.
• Supports SMBus protocol interface for access to the AMB configuration registers.
• Detects errors on the channel and reports them to the host memory controller.
• Automatic DDR2 DRAM Bus Calibration.
• Full Host Control of DDR2 DRAMs.
• Over-Temperature Detection and Alert.
• Hot Add-on and Hot Remove Capability.
• MBIST and IBIST Test Functions.
• Transparent mode for DRAM test support.
• Low profile: 133.35mm x 30.35mm
• RoHS Compliant Product
With the Heat Sink for Apple Mac Pro System: Max 23.10 +/- 0.10
ISO9001-2000 REGISTERED
Because of heat problems, Apple requires that Modules use larger-than-normal heatsinks . Normal sized FB-Dimm heatsinks will not work in Mac Pro Towers. Memory America heat sink will keep temperature below 145 degrees for optimum performances.
Compatible with Apple Mac Pro 8-core 2.8GHz (MA970LL/A), Mac Pro 8-core 3.0GHz (BTO), Mac Pro 8-core 3.2GHz (BTO), Mac Pro Quad 2.8GHz (BTO).
- Return for refund within: 30 days
- Return for replacement within: lifetime
For a return for credit, this item must be returned to Memory America within 30 days of the invoice date for this policy to apply. For a replacement, we offer a Lifetime warranty and support on all memory upgrades. “Return” constitutes receipt of the product by Memory America, and not the mere issuance of an RMA.
The following conditions are not acceptable for return, and will result in the merchandise you have returned to Memory America being returned to you:
- Modules exhibiting physical damage
- Modules that are missing the manufacturer label containing model number, part number or serial number
- Modules that are missing the manufacturer warranty label
Fully Buffered DIMM
Fully Buffered DIMM (or FB-DIMM) is a memory technology which can be used to increase reliability, speed and density of memory systems. Conventionally, data lines from the memory controller have to be connected to data lines in every DRAM module. As memory width, as well as access speed, increases, the signal degrades at the interface of the bus and the device. This limits the speed and/or the memory density. FB-DIMMs take a different approach to solve this problem. As with nearly all RAM specifications, the FB-DIMM specification was published by JEDEC.
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