Specifications:
• DDR3 PC3-10600
• Timing: 9-9-9
• CL=9
• DDR3-1333MHz
• 1.5V
• 512Meg x 64
204-pin small outline dual inline memory modules (SODIMMs) are the form factor used to provide DDR3 memory modules for notebook computers and other small form factor computing platforms. 204-pin SODIMMs are currently available in PC3-8500 (DDR3 1066MHz) speeds.
To use DDR3 memory, your system must have both a 204-pin SODIMM slot and a chipset that supports DDR3 memory. A DDR3 SODIMM will not fit into DDR2 or DDR memory sockets.
SODIMMs are smaller and thinner than regular DIMMs, and the 204-pin SODIMM PCBs are always ~2.6 inches long and are usually around 1.18 inches high (though the heights can vary slightly). They consist of a number of memory components (usually black) that are attached to a printed circuit board (usually green). The number of memory components on a 204-pin SODIMM's printed circuit board (PCB) can vary, but the PCB will always have 102 pins on the front and the back both, for a total of 204 pins. The gold pins on the bottom of the SODIMM provide the connection between the memory module and the memory socket.
- Return for refund within: 30 days
- Return for replacement within: lifetime
For a return for credit, this item must be returned to Memory America within 30 days of the invoice date for this policy to apply. For a replacement, we offer a Lifetime warranty and support on all memory upgrades. “Return” constitutes receipt of the product by Memory America, and not the mere issuance of an RMA.
The following conditions are not acceptable for return, and will result in the merchandise you have returned to Memory America being returned to you:
- Modules exhibiting physical damage
- Modules that are missing the manufacturer label containing model number, part number or serial number
- Modules that are missing the manufacturer warranty label
DDR3 SDRAM
In electronic engineering, DDR3 SDRAM or double-data-rate three synchronous dynamic random access memory is a random access memory interface technology used for high bandwidth storage of the working data of a computer or other digital electronic devices. DDR3 is part of the SDRAM family of technologies and is one of the many DRAM (dynamic random access memory) implementations.
DDR3 SDRAM is an improvement over its predecessor, DDR2 SDRAM, and the two are not compatible. The primary benefit of DDR3 is the ability to transfer at twice the data rate of DDR2 (I/O at 8× the data rate of the memory cells it contains), thus enabling higher bus rates and higher peak rates than earlier memory technologies. In addition, the DDR3 standard allows for chip capacities of 512 megabits to 8 gigabits, effectively enabling a maximum memory module size of 16 gigabytes.
With data being transferred 64 bits at a time per memory module, DDR3 SDRAM gives a transfer rate of (memory clock rate) × 4 (for bus clock multiplier) × 2 (for data rate) × 64 (number of bits transferred) / 8 (number of bits/byte). Thus with a memory clock frequency of 100 MHz, DDR3 SDRAM gives a maximum transfer rate of 6400 MB/s.
It should be emphasized that DDR3 is a DRAM interface specification; the actual DRAM arrays that store the data are the same as in any other type of DRAM, and have similar performance.
Backward compatibility
DDR3 DIMMs are not designed to be backward compatible with DDR2 DIMMs. The notch on DDR3 DIMMs is in a different position from DDR2 DIMMs, and the pin density is higher than DDR2 DIMMs in desktops. Notebooks have 204-pin modules for DDR3 and 200-pin modules for DDR2, also the notch on DDR3 modules is in a slightly different position than that on DDR2 modules.
Higher performance DDR3 DIMMs are compatible with lower performance DDR3 DIMMs; however, the higher performance module runs at the lower module's frequency. Using lower performing DDR3 memory in a system capable of higher performance results in the bus running at the rate of the lowest performance memory in use; however, in many systems this performance hit can be mitigated by setting the timings of the memory to a lower latency setting.
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